Job Title:  Microelectronics Assembly Technician

SUMMARY

Responsible for assembling complex microelectronic hybrid circuits based on thick and thin film substrates populated with wire bonded die and surface mounted components, utilizing microelectronic hybrid assembly techniques and equipment.  Provide support to convert a prototype hybrid circuit into a production model, by interfacing with CAD and engineering departments. Document processes, assembly methods, prepare documentation to serve as basis for assembly drawings. Train the MET Engineering Support Technician/Wire bonder to develop in-depth knowledge and understanding of the evolution of forming a prototype from an engineering concept to a preproduction product.  Review assembly drawings for accuracy and write ECN’s as necessary.

ESSENTIAL DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned.

• Engineering Support
  • Assemble prototype and preproduction hybrid circuits from sketches and assembly drawings.
  • Determine best process materials and assembly techniques to be used in preproduction units.
  • Interface with engineering to make prototype alterations to meet engineering requirements.
  • Review spec working prototype and make recommendations for most efficient production lay-out.
• Design Support
  • Interface with purchasing, support Tech A & Process Engineer for follow up on material delivery status
  • Assist incoming inspection with acceptance or rejection of new parts.
  • Expedite move of material to designated Engineer or Location.

• Hybrid Fabrication Support
  • Assemble hybrid modules using the following processes: hi-temp and low- temp solder reflow, hand soldering with hot plate and microscope assist, non-conductive and conductive epoxy attach, eutectic die attach, wire bonding, gap welding, hermetic sealing and other hybrid related industry standard fabrication and process methods.
  • Assemble hybrid modules using the following equipment: ball-wire bonder, wedge-wire bonder, thermo compression-wire bonder, deep access-wire bonder, scissor-wire bonder, eutectic multy-collet-die attach, multiple stage reflow machine, soldering irons, soldering pots, stereo-zoom and metallurgical microscopes, hot plates, curing ovens, inert gas regulators, epoxy dispensers, parallel gap welder, hermetic parallel seam welder, destruct-non destruct wire bond pull tester, shear tester, and other hybrid related industry standard equipment.
  • Maintain accurate inventory records for all WIP and raw material stored in the hybrid lab area.
  • Develop and recommend process fabrication and changes to products.

•  Quality Support
  • Perform all hybrid standards and practices within AR’s ISO policy.
  • Manufacture hybrid circuits with a workman ship standard capable to meet AR workmanship standards and military hybrid assembly standards.
  • Perform wire bond pull test and accumulate records/result for statistical sigma limits establishment.
  • Perform die attach shear testing for thermo analysis.

Qualifications and Experience 

• High school diploma or equivalent required; technical training or certifications in microelectronics preferred.
• 2–3 years of experience in microelectronic hybrid circuit assembly.
• Hands-on expertise with thick and thin film substrate technologies.
• Proficiency in assembly techniques:
  • Wire bonding (ball, wedge, thermo-compression)
  • Eutectic die attach
  • Solder reflow (hi-temp and low-temp)
  • Epoxy attach (conductive and non-conductive)
  • Gap welding and hermetic sealing
• Familiarity with industry-standard equipment:
  • Wire bonders, soldering irons, curing ovens, microscopes, epoxy dispensers, gap welders, hermetic seam welders, and related tools.
• Ability to interpret engineering sketches and assembly drawings.
• Experience collaborating with CAD and engineering teams to transition prototypes to production.
• Strong documentation skills for process development and ECN preparation.
• Knowledge of ISO and military hybrid assembly standards.
• Experience with quality assurance testing (wire bond pull tests, die shear testing).
• Excellent problem-solving, communication, and ability to train technical staff.