Job Title:  Analysis Technician

The Analysis Technician is responsible for performing advanced failure analysis on electronic boards (PCBs), SMT/TH components, and complex electronic systems. This role conducts deep diagnostics, identifies root causes, performs high precision rework, and generates detailed technical reports to support Engineering, Quality, and Production teams.

Key Responsibilities:

Diagnosis & Failure Analysis

• Perform component level and circuit level troubleshooting.
• Interpret electrical schematics, drawings, and BOMs.
• Use advanced test equipment: oscilloscope, multimeter, CT, AOI, XRay.
• Identify intermittent faults and irregular electrical behaviors.
• Conduct root cause analysis using methods such as 5 Whys, Ishikawa,

Rework & Repairs

• Execute complex rework on fine pitch SMD components (QFN, BGA, uBGA, QFP, CSP).
• Operate BGA rework stations and hot air equipment.
• Perform reballing and replacement of critical components.
• Apply soldering techniques according to IPC‑7711/7721 standards (certification preferred).

Documentation & Reporting

• Create detailed failure analysis reports.
• Document findings in MES or ERP systems (SAP, Oracle, etc.).
• Update databases for recurring failures and trend analysis.
• Communicate results to Engineering and Quality for corrective actions.

Advanced Technical Support

• Collaborate with Product Engineering on the new board for validation.
• Provide DFM/DFT improvement feedback from a repairability standpoint.
• Support internal and external audits.

Requirements:

• Technical degree in Electronics or related field required. Engineering degree preferred.
• 3+ years in electronics diagnostics, repair, or failure analysis.
• Proven experience with BGA/QFN components.
• Experience in electronics manufacturing, automotive electronics, telecom, or medical devices (Preferred).
• Knowledge of Moisture Sensitive Devices Handling.
• Knowledge of the ESD to the components (Electrostatic Discharge).
• knowledge on the IPC-610 Criteria Class 3.
• Knowledge of the BGA rework process.
• Knowledge of SMD and TH components assembly.
• IPC 7711 / 7721 certified